Alinx AXU5EVB-P Dev Board & Kit with AMD Zynq US+ MPSoC ZU5EV

The Alinx AXU5EVB-P Dev Board equipped with the AMD Zynq UltraScale+ MPSoC-series device, delivers standout performance with DDR4 SDRAM, eMMC Flash, QSPI Flash, PCIe, FMC LPC, SFP+, M.2, DPCAN/RS485, AXU5EVB-P Dev Board is suitable for Artificial Intelligence, Computing, Automotive, Industrial, Video, and Communication, etc.

The AXU5EVB-P Dev Board system includes a comprehensive set of interfaces and connectivity options, such as 1 x FMC LPC connector with 36 pairs of LVDS I/Os (1.8V), 2 x SFP+ supporting up to 12.5Gbps per line, and 2 x Gigabit Ethernet (1 on PS, 1 on PL). It also features 1 x PCIe Gen3 2, 1 x M.2 Card slot on PS, and multiple communication options including 2 x UART (1 on PS, 1 on PL), 1 x DP Interface on PS, 1 x 2-lane MIPI on PL, 2 x CAN on PS, 2 x RS485 on PL, and 2 x USB3.0 + 2 x USB2.0 on PS. Additional components include in AXU5EVB-P Dev Board 1 x Micro SD, 1 x RTC, 1 x 4-Kbit I2C EEPROM, and a temperature sensor (LM75). The AXU5EVB-P Dev Board is equipped with 2 x HDMI ports (1 in, 1 out), along with LED indicators (power, done, and PL) and KEY switches (reset and user-defined). AXU5EVB-P Dev Board operates on a 12V single supply and has a compact 225.81 x 106.65 mm form factor, ideal for high-performance embedded applications.

Features:

1. Powered by AMD/Xilinx Zynq UltraScale+ MPSoC XCZU5EV-2SFVC784I: High-performance, adaptive SoC.
2. Design-In Kit: Get started with development straight out of the box.
3. Accelerates Time-to-Market: Streamlines deployment for Zynq UltraScale+ MPSoC-based applications.
4. High-performance AMD/Xilinx Zynq UltraScale+ MPSoC: ARM Cortex-A53 and Cortex-R5 cores, Mali-400MP2 GPU, and advanced video codec.
5. Pluggable Design: 4 x Panasonic board-to-board connectors for easy integration.
6. Generous Memory & Storage: 4 GB DDR4 SDRAM (PS), 1 GB DDR4 SDRAM (PL), 32 MB QSPI Flash, and 8 GB eMMC Flash.
7. Versatile for Applications: Ideal for video processing, AI, and embedded systems.

Applications :

1. Automotive
2. AV Broadcasting
3. Deep learning
4. Digital Signal Processing
5. 5G Wireless and Wire Communication
6. Data Centers
7. Drive / Motion Control
8. Industrial Internet of Thing

Package Includes:

1 x System-on-Module

1 x Base Board

1 x Heatsink Kit (preinstalled)

1 x USB Downloader Cable / set

1 x 12V Power Adapter

1 x PCle Fence

1 x Mini USB Cable

1 x Card Reader

1 x TF Card