ACE 100ml No Clean 0% Soldering Liquid Flux

ACE 100ml No Clean Soldering Liquid Flux has been designed for use in the electronic industry to improve effectiveness in dip and wave soldering of conventional PCB assemblies.

Process Considerations:-

• The flux needs to be pre-heated post application in order to activate it.
• Recommended temperature may be anywhere between 90˚C to 150˚C (194˚F to 302˚F) depending upon circuit board design, board thickness, length of contact time with molten solder, speed of solder flow and preheating time.
• Solder pot temperature should be set between 245- 260˚C (473-500˚F) for Sn63Pb37/Sn60Pb40 alloy and between 260-270˚C (500-518˚F) for SnCu/SnAgCu alloys.
• Please note that the above are only guidelines and the optimum settings for a given assembly may vary keeping in mind the above mentioned factors.

• Flux residues are non-corrosive and non-conductive, thus do not require removal in most applications. In case residue removal is required our PCB Cleaner may be used for the same. 

Storage and Shelf Life:-

Applications :

• Application may be done manually using a brush or via spraying.

Specifications :

• Specific Gravity: 0.82±0.005
• Percent solids (theoretical): 1.5
• State: Liquid
• Acid number: 35.0mg KOH/g
• Volume : 100ml
  

Package Includes :

1 x ACE 100ml No Clean 0% Soldering Liquid Flux